The chips are being made by TSMC
Xiaomi’s XRING 01 Goes Official As Company’s First Custom 3nm SoC With 19 Billion Transistors, 10-Core Cluster, LPDDR5T Support, And A Host Of Other Impressive Specifications
The XRING 01 has officially been announced as Xiaomi’s first custom 3nm SoC, and it will currently be found in one smartphone and one tablet
wccftech.com
Setting a new milestone in the silicon race is Xiaomi’s XRING 01, which has been officially announced today, and is the company’s first 3nm chipset that competes with the Snapdragon 8 Elite, Dimensity 9400, Dimensity 9400+, Apple’s A19, and A19 Pro. The Chinese firm has now laid out all the details, providing the necessary specifications of its latest chipset, so let us dive into the launch immediately.
Thanks to utilizing TSMC’s second-generation 3nm technology, the XRING 01 sports 19 billion transistors and a die size of 109mm², enabling incredible power efficiency. To help with the performance bit, Xiaomi has taken a different approach with the SoC’s cluster, and adopted 10 cores instead of the more common 8-core one to deliver impressive single-core and multi-core performance. Interestingly enough, the last two cores belong to the Cortex-A520, with six Cortex-A725, and lastly, two Cortex-X925 cores clocked in at 3.90GHz.
Xiaomi also has a binned version of the XRING 01 that powers the Pad 7 Ultra tablet, and even though it sports downgraded clock speeds, its Geekbench 6 results do not reflect those frequency changes. The in-house chipset also adopts the newest technology standards, ranging from LPDDR5T RAM support, Wi-Fi 7, UFS 4.1 storage, and USB 3.2 Gen 2. As for GPU performance, the XRING 01 relies on the 16-core ARM Immortalis-G925. So far, there are only two devices that will feature the in-house chipset, with the first one already mentioned above.
China's Xiaomi to launch self-developed mobile chip in late May
Chinese smartphone and EV maker Xiaomi said on Thursday it will launch a new self-developed advanced mobile chip, XringO1, in late May, as it seeks to power more of its high-end devices with proprietary silicon.
The XringO1 mobile chip was developed by Xiaomi's internal chip design unit using ARM's architecture and manufactured by the world's largest contract chipmaker TSMC using its advanced 3-nm node, according to a source with direct knowledge of the matter, who declined to be named.
Xiaomi, the world's third largest smartphone maker that also manufactures home appliances and cars, began designing its own chips in 2014 and launched its first mobile processor, the 28-nm Pengpai S1, in 2017, which debuted in the Xiaomi 5C smartphone.
Following U.S. export restrictions imposed last year, TSMC is no longer permitted to manufacture AI chips for mainland Chinese clients if the designs require 7nm or more advanced nodes. However, smartphone chips have largely been exempt from these restrictions.
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