woo... at the time of posting, 80+ vs 258- ratings.
But comparing to the early "leaked" pictures (phone on MBP keyboard and the others on weiphone.com) they look quite similar in terms of the round edges and the engadget-claimed "slightly thicker" form factor. Headphone jack is also as sources have claimed not to have that deep groove, so other headset pins can also be used.
I think it could be true... although the current phone is already thick with my clear plastic casing. but comparing to other smartphones it remains sleek.
So I'll see.
But comparing to the early "leaked" pictures (phone on MBP keyboard and the others on weiphone.com) they look quite similar in terms of the round edges and the engadget-claimed "slightly thicker" form factor. Headphone jack is also as sources have claimed not to have that deep groove, so other headset pins can also be used.
I think it could be true... although the current phone is already thick with my clear plastic casing. but comparing to other smartphones it remains sleek.
So I'll see.