As someone that spent a considerable time (19 years) in semiconductor manufacturing, here is my analysis:
Duh.
Chips aren't a "design it in our garage" like the Apple I/II were. The pipelines are very long, and development time is 3-4 years, from inception to delivery of the first chip.
So, they are already in the initial design of the A14/A15 chip now, and they are looking at new materials now in the design/development. The holy grail in the pre-1990's was copper on chips, where aluminum (aluminium Jony) was used for the vias and interconnects, but had issues with voids in plugs, which would kill the device. Anyhow, using Cu on the layers above the Si (as Cu attacks the Silicon on the wafer) solved that problem, along with a bunch more (i.e. dissimilar metals at the plug/interconnect with W/Al).*
Anyway, back to what I was saying, people don't just jump in with their chip design and make it happen overnight, or next week with their new chip. This isn't 1959.
Duh.
Chips aren't a "design it in our garage" like the Apple I/II were. The pipelines are very long, and development time is 3-4 years, from inception to delivery of the first chip.
So, they are already in the initial design of the A14/A15 chip now, and they are looking at new materials now in the design/development. The holy grail in the pre-1990's was copper on chips, where aluminum (aluminium Jony) was used for the vias and interconnects, but had issues with voids in plugs, which would kill the device. Anyhow, using Cu on the layers above the Si (as Cu attacks the Silicon on the wafer) solved that problem, along with a bunch more (i.e. dissimilar metals at the plug/interconnect with W/Al).*
Anyway, back to what I was saying, people don't just jump in with their chip design and make it happen overnight, or next week with their new chip. This isn't 1959.