Interesting.. So for simplicity, Tcase is always somewhere in between the two values? What would typical Rdc and Rch values be?
Very rough estimation is Rdc ~ 0.1-0.2 K/W and Rch ~ 0.02-0.08
They can be deduced from actual hardware monitor measurements.
The whole idea of Intel thermal profiles is second-guessing core temperature based on Tcase and keeping it (Tcore) in control. The profiles are sloped because of the component related to dissipated power.
Here is what W3500 datasheet says:
The processor thermal specification uses the on-die Digital Thermal Sensor (DTS) value
reported via the PECI interface for all processor temperature measurements. The DTS
is a factory calibrated, analog to digital thermal sensor. As a result it will no longer be
necessary to measure the processors case temperature. Consequently, there will be no
need for a Thermal Profile specification defining the relationship between the
processors TCASE and power dissipation.
However, the question is: does SMC report actual heatsink temperature or does it second-guess what Tcase would be and reports that?