Originally posted by stingerman
The 970 is a 'superset' of the Power4 core. It contains additional instructions, it contains a VMX unit that the Power4 does not.
I've not looked too much into the details of the difference; I'm mainly going on what Varadarajan said at NASA (which I quoted almost word for word, he made the comment that it was ironic that a chip designed for supercomputer use was modified for a desktop then that desktop chip was put in a supercomputer, as well as a comment the 970 was 'essentially a subset of the Power4'). The additional parts will, of course, be important to any factor. I didn't say "everything will be immediatly usable" but the vast majority of improvements should still be. The VMX unit was admitably ignored by Varadarajan and Tech (most of the things the cluster is to be used for is double-precision, the VMX is single); and he said they wanted to use it if they could but hadn't tried anything yet.
It uses faster components and contains better pipelining to take it to a much faster frequency while allowing it to operate at a lower voltage. The new 970FX contains PowerTune extensions that do not exist on the Power4 but are promised for the Power5 later this year.
Lower voltage would lower heat (all other things equal); and except in the case of a Power4 optimization on voltage or pipelining (which would either already be in the G5 or have semi decent odds of remaining transferable) I don't see the difference. The fab process is, TTBOMK, the same (or incredibly similar). If the differences in G5 and Power4 are in the Power5 (in favor of G5 similarity) then just replace 'watch the P4' with 'watch the P5'
(back to top of 2nd quote)
Faster components will generate more heat, generally speaking; but as I stated earlier; better cooling and use techniques should still be transferable. I'm talking about better use of things like SoI and whatnot; as IBM is more likely, if you ask me, to put those in their super-computer chips first as those can normally take the 'development cost' hit better.
Certain developments on the Power4/Power5 line would be silly or strange to transfer; such as clock rate increases, and 'multicore' technology. But developments in cooling and power consumption seem - for the most part - to be the same quinessential chip.
Most importantly; I can't see the vector unit inside the G5 making more (and I doubt as much) heat as a 'core' in the Power4s (in terms of watts over area and overall size of chip) -- a Power line of the same generation as the G5 would put out more heat and more/equal heat per square-cm.
I'm not saying the chips are equal; but I'm saying that from a fabrication type (SoI and other IBM techs) and cooling approach (CPU die cooling) the chips are fundamentally very similar. What I'm saying here is admitably somewhat guess-work but I'm going off a combination of the knowledge I have from building my own watercooling systems and the research I did for that and 2 years of Computer Architecture and Design classes. I'm not an expert by any means; but I hope I can at least hazzard a good guess after all that.
😛
~Stolid~