deconstruct60
macrumors G5
Yes, you are probably right that there won't be 45W Arrandales. Although that does leave the interesting alternative, that Apple could use this thermal room to ask Intel to make special Arrandales for them with overclocked GPUs to take full advantage of the 45W TDP,
Is this a stacked or horizontally placed dies in the MCM? If it is stacked you now have a higher heat source on top/under of your 32nm chip die. If horizontal placed have even larger skew of the heat to one side of the package.
Given they are trying to minimize board space some chance this is stacked.
If in the same ballpark as the 9400M wouldn't need this. It isn't like Apple's stuff doesn't run abnormally cool now.
And I agree that Apple is stuck on some thin mantra. There is a point where enough is enough, and 1" was it. I don't see what advantage bending over backwards in limiting yourself just to claim "under an inch" thickness gets you other than being able to say said line.
Anorexic Apple.
