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The charging port is not exclusive to computer connectivity. How about charging in your car? How about CarPlay? How about charging practically anywhere you don't have your expensive Apple-exclusive charging pad?

Doing away with the port is unlikely in 2021. Now, 2041, possibly.
But we all know apple kills stuff relatively quickly. They only wait like 5 years to kill 32bit support and maybe one or two more years to give middle finger to windows on Mac (I mean bootcamp). Apple also “courageously” removes the headphone jack in iPhone 7, prompting backlash that ignored.

I always think current wireless charging is just dumber version of wired charging and people are bound to the location of the charging pad while iPhone is topping up. Let’s see how this “port removal” thing pans out in 2021, and how those wireless charging praiser react when there is no charging pad around and their phone runs out of juice.

Guess I’d better stop here.
 
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Look at the lower left corner of the board, the screw holes on the left, and the inside corner of the L... that's not single layer.

The right side is what single layer looks like.
It is a single PCB design, the top PCB extension board is just for plugs tbh.

In the industry, we call it "through-hole" parts. Without the extension board, it will take up both sides of the bottom PCB.
 
I don't think that's necessarily the date, because if it was, iFixit's iPhone 11 was built in 2016.

I see Week 29 and Week 32 of 2019 for the iPhone 11 Pro and Pro Max.
 
It is a single PCB design, the top PCB extension board is just for plugs tbh.

In the industry, we call it "through-hole" parts. Without the extension board, it will take up both sides of the bottom PCB.

No. It's called a stacked PCB. If it's similar to the existing motherboards, there's three component sides: top and bottom of the top PCB, and top (inside) of the bottom.


Stacked PCBs are not special in itself (Arduino shield), the feat is Apple is using a PCB interposer that's reflowed, not a connector.

A through-hole part is totally different. It's when the lead on the IC or connector has to physically pass through the PCB.
 
This motherboard/chip better be wayyyyyy faster than A13. The A13 is just not fast enough for 2019 standards. Tim and Co needs to stop stacking off and pull off really fast improvements to the A series chips. I expect the next gen to be at least a few times faster (not just ~20% faster like it has been the case for the past few years (A10-A13)).
 
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