Yes, I am 100% sure that TDP does not represent maximum thermal dissipation. At least it doesn't with Sandy Bridge, and it most likely won't apply to Ivy.
You just make it sound more complicated than it is.
TDP is the maximum thermal dissipation that the cooling system needs to be able to deal with. Sandy Bridge can exceed the TDP for short durations but that doesn't matter because it may not exceed it long enough to have an adverse effects.
Intel does take Turbo boost into account but it is designed so it has no effect on the maximum TDP. And TDP doesn't change because of Turbo. The TDP is a fixed value of sorts. That the chip can for short durations spike in power and heat changes nothing.
You may say that is just tautology but for all practical purposes it really doesn't make any differences.
That the chip can over clock just means it heats up quicker not that it actually gets hotter at the end of the day.
Some people think the chip under full load just consumes 45W with turbo speeding it up to the limit but a slower chip will consume less even if it is the same TDP class.
With a none mature process binning can negate some of the effect but with a mature process most chips are about equally cool at the same clock speed. They end up differently fast only because of factory settings.
A 2675 QM has 6 turbo bins for 4 cores. Thus it can clock at a max 2.8Ghz when all for cores are active. A 2860QM has 8 bins and starts at 2.5Ghz which means 3.3Ghz max. If the target was to run either chip at exactly 45W they'd probably both end up running a 10 min encode job at 2.6Ghz and be equally fast or some clock rate that would be really close.
TDP of 45W even with Sandy Bridge is no average power consumption and the internal Turbo power target is probably not simply 45W for any chip that is that TDP class.