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This may not affect most users, but it is the principle behind it that makes this terrible news.
Right.... the disappointing part here is that Apple went out of its way to redesign things in a way that was unnecessary except for a supply chain shortage.

It might have been the wise thing to do from a business/sales standpoint, to make sure there weren't big product shortages and to get the M2 out on time? But the fact is, you're buying a machine that made compromises only because of limited availability of materials, vs any technical reason.

Makes me more content to keep my M1 Max and wait until the next notebook update (which I'd truthfully do anyway, since my funds are limited).
 
Will this affect the majority of users? No. Could this heatsink lead to throttle the CPU/GPU under heavy workloads? Yes. Is it acceptable for a 2499€ (base 14" model in Italy) machine that has to dissipate 40 Watt? I absolutely think not!
 
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It's not a heatsink in a classical sense, the thing that itself cools the chip (fins, holes, airflow etc), but just a small heat plate that has one function - deliver the heat from the surface that needs it to the heat pipe, that's it.
Smaller surface, smaller plate, nothing else to do there - but again so many speculation about "smaller must cool less" ;)
 
That's not a heatsink. That's just the interface block that you are describing. The heat is transferred to the two radiator fins. The fans then blow air across the fins. The radiator fins are the heat sink. At least, that's what I classically think of as the heatsink.

This interface block completely covers the chip. It's fine.
This explanation needs to be elevated to the top comment.
 
But I thought the butterfly keyboard was Jony Ive’s fault? At least that’s what everyone here says.
if usual command structure is followed by apple like every other big company, ive probably just issue out the spec design dimension and had the engineer team work within that framework. i doubt ive had the technical knowhow to actually put forth the butterfly keyboard mechanism
 
Except it’s already been proven not to compromise performance at all.

Quit pretending you know more than Apple’s engineers.
Pretty sure the thermal designs on two of my Macbook Pros with Intel chips that suffered fried logic boards from known thermal issues (thermal paste issue) under normal professional use, were also approved by these all-knowing Apple engineers. I quit pretending that Apple always gets it right a long time ago.
 
Interesting how they claim its due to supply chain issues.
Isn't it another way of saying that they can't hit profit margins targets if they keep it the same, so they opted for cheaper components?

Everything has gotten more expensive for everyone, everywhere, and even Apple has bigger bills to pay for every service and product they put out.

So instead of letting investors down, Timothy von Apple Park takes a little pay cut and consumers get quite a lot less MacBook/$.

🤷‍♂️
 
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I doubt people will see the impact of this in real world performance.. are you really going to be sitting at your desk saying "if only my heatsink was 6mm larger.."
I'm most certainly sit at my desk saying "If only it was 6mm larger!!".

But for my MacBook's heatsink, I don't think I'll care much.

😏
 
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The MaxTech video comparison between the M1 Pro 14" and M2 Pro 14" did indicate that the smaller heatsink leads to diminished thermal performance - and showed the M2 Pro system got fairly significantly warmer under the same workload. Kind of sucks, but that's interesting to know the process of what led them to make that engineering decision.

That's exactly wrong.
First, optimal operation temperature is not an absolute number set in stone - if you make a chip, that's faster, gives more performance, and it runs a bit hotter, BUT you cool it just fine AND you want it to run this way, AND the battery is still mostly the same or even better - then there's no problem.
Looking at temperature alone and finding visually the only difference as the "reason" for the "wrong temperature", is not exactly the "scientific" way to do it..
Also the plate is smaller, because it's transferring (not cooling) heat from a smaller surface, the chip and memory around are smaller, you don't need larger plate if there's nothing to cool bellow it, end of story.
 
I haven’t read the thread, but where does the claim that’s it’s because of supply chain issues get any supporting evidence? The analysts cited has sound *logic*, but logic itself doesn’t mean much if Apple made the choice for their own reasons.
 
I called this. At this moment there are premium overcharging and critical components being saved on.

Supply chain issues, yeh right.

Yeah classic milk dem apples.

Next up: iPhone 15 periscope lens but 0.5 MPX specs and corrected with software performing like a 48MPX.

I hope they do not continue with this practises when we get the M5 and bringing back rocket launches when firing up a YouTube video like Intel days.
 
I haven’t read the thread, but where does the claim that’s it’s because of supply chain issues get any supporting evidence? The analysts cited has sound *logic*, but logic itself doesn’t mean much if Apple made the choice for their own reasons.
It's a "deduction pyramid scheme" fail from the beginning ;)
 
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So they give it extra power, and then cripple it making it thermal throttle due to not being able to buy the heat sinks?
Not a good strategy. But that means when the supply chain issues are resolved people may well buy later M2 MB Pros that out perform the early models. For the same price!
 
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Well actually if you watch the videos you will see that the M2 Pro and Max chips under load can easily hit 100 degree celsius. That seems to very much be in Intels territory.

Interesting as Intel and AMD chips can put outperform Apples silicon, but so it should for all that extra heat and power they use.
 
They hit that temperature if you redline them for thirty minutes straight.

You’ve already forgotten that intel chips will hit that temperature just browsing the web.

Apple Silicon continues to be superior in every single way, but I guess the internet needs something to whine about.

Intel and AMD have shown they can beat Apples Silicon in performance, but obviously they use a lot more power to do it and used to create more heat. But not now it seems..
 
Not sure what the outrage is, other than MaxTech needing a few more hyperbolic videos to push out. The one on the M2 looks thicker, meatier. Also, isn't the M2 SoC a bit smaller, which would result in a slightly smaller plate? Maybe I am not understanding what the issue is.

Apple clearly had this part mass manufactured exactly with this design and at this size as they were ramping up parts for this MBP revision, so it was obviously tested prior to committing to that order.

Also, how can 'supply chain issues' change the size of a part? Wouldn't this produce fewer parts, not smaller parts? Was there a shortage of metal to pour into the mold? I don't think Apple buys pre-made parts and heatsinks, these are most likely designed for Apple per Apple spec. And who exactly determined that 'supply chain issues' played a role in this revised part?
 
Well, my M1 Max runs ice cold with my current work load. I'd prefer it to be a bit warmer, particularly when I'm "working" while sitting on the commode. This aluminum is too cold. This may be my excuse to upgrade.
 
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