Correct. Seems to me to be nearly identical. The fin pitch for TSMC 7 seems to be about 10% less than intel 10. Fin width seems to be identical. Intel’s mimimum metal pitch is about 10% less (but you pretty much never use minimum metal pitch anyway).Yes, but are they? Genuinely asking. I believe not.
BTW I know what a nm is. The question is not about how the fundamental unit for lenght is defined but about how does it relate to transistor density in fabrication processes nomenclatures.
From a related wikipedia page:
"The naming of process nodes by different major manufacturers (TSMC, Intel, Samsung, GlobalFoundries) is partially marketing-driven and not directly related to any measurable distance on a chip – for example TSMC's 7 nm node is similar in some key dimensions to Intel's 10 nm node (see transistor density, gate pitch and metal pitch in the following table)."
My understanding was that TSMC 7nm was very close to Intel's 10nm albeit a tiny bit bigger, but I got that from regular tech websites so you're probably right. I take from your post that TSMC's 7nm isn't significantly smaller than Intel's 10nm either.
Overall, very similar process design rules, seems to me.