2011 iPad2 45nm 10.09 x 12.15 mm (122.50 mm^2)
2012 iPad2 32nm 8.19 x 8.68 mm (71.09 mm^2) delta 51.41 or 42.0% less
2013 AppleTV3 28nm 6.0 x 6.0 mm (36.0 mm^2) delta 35.09 or 49.4% less
122.5, 36.0 delta 86.5 or 70.6% less
36/122.5mm=29.4% of the original area. Between a quarter and a third the area.
These are the outsides of the packages or the actual dies ?
If it is the packages that doesn't necessarily directly correlate one-to-one to the die. If there is more heat to dissipate, differing pin out numbers , and/or the other elements inside the package are larger, then it isn't just necessarily the ARM core that is driving these sizes. I think folks are making pretty broad assumptions if these are package measurements.