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The M1 Pro is a M1 Max with a part chopped of. So actually Apple creates all their Mac SoCs from two Dies.

Nope, M1 Pro is a separate die from the M1 Max; it is the design that is "chopped" not the actual physical chip...

So the M1 family is still a Three Die Circus...! ;^p
 
Okay, maybe I did miss that information. Where did you get that from?

Think about it...

Only the bottom set of GPU cores are failing...?

Throwing away nearly half of a M1 Max die to get a M1 Pro die makes sense how...?

All four edges of the M1 Max die have a purpose; two for memory, one for I/O, and one for UltraFusion; so not really any sides that can be chopped...

Google will bring up all kinds of info on the Apple silicon SoCs...
 
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Think about it...

Only the bottom set of GPU cores are failing...?

Throwing away nearly half of a M1 Max die to get a M1 Pro die makes sense how...?

All four edges of the M1 Max die have a purpose; two for memory, one for I/O, and one for UltraFusion; so not really any sides that can be chopped...

Google will bring up all kinds of info on the Apple silicon SoCs...

Throwing away an entire M1 Max chip because there are defects on the bottom half makes sense how? It would make more sense to "chop" off the bottom half and use the rest of the chip as an M1 Pro. Fab'ing all M1 Max SoCs and "chopping" defective dies down to M1 Pro makes much more sense using your own logic.

I'm not claiming one way of another here, but the M1 Max is a fairly massive die, prone to higher risks of having defects. One way to get around that and cut down on waste would be to add redundancy in the design so that it could be used as a lesser variant, a.k.a. binning. So an M1 Max with a catastrophic defect on the bottom half could still be used as an M1 Pro.
 
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