Seen lots of naysayers preaching that the 4g wont be 64gb as the iphone cant fit 2 32gb flash memory and that 1 64gb stick is too expensive/not enough in production yet.My question for the more knowledgeable, how are the skeptics so certain the inside of the iphone hasnt been completely redesigned to fit them?
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Why are pple not considering the fact the 4g may b redesigned to fit 2 memory chips?
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Maybe I'm misinterpreting the designs I've seen for the next phone, but it does seem like it has more room on the inside. Seems thicker than past phones. You may be right.
minus "fact"
insert "possibility"
Then you've got yourself a relevant title
I would love if they made more room, but I'll wait 5 days to find out. Fingers crossed!
insert "possibility"
Then you've got yourself a relevant title
I would love if they made more room, but I'll wait 5 days to find out. Fingers crossed!
According to Gizmodo it has less. And it's 33% thinner. AND the battery is larger.
So I don't see how.
minus "fact"
insert "possibility"
Then you've got yourself a relevant title
Fair point but my title is already using max characters
More room may be nice, but I'm more tempted to see if the processor is better along with the higher res screen. I hope they keep the oleophobic screen though, it's a nice design.
Probably somewhere on the main logic board (the L shaped piece in the middle). If you want a precise location you'll have to provide a better picture of the logic board.
Just out of interest, this is the 4g prototype, where on the picture is the flash memory located?
Under the metal shielding on the PCB in the middle of the picture.
Hard to tell from that photo. Here's some shots inside an older iPhone. It'd be something like that...part of the motherboard.
http://techon.nikkeibp.co.jp/english/NEWS_EN/20070704/135309/
Never know, if the iPhone is truly bigger in physical capacity, can they stack the memory chips on top of one another?
Edit: they already stack NAND chips to get the current densities. It takes 16 stacked to hit 64GB
http://www.toshiba.com/taec/news/press_releases/2009/memy_09_585.jsp
They took all the chips that used to lie on one side of a much larger PCB and have now stacked them up on each side of a much smaller PCB. Looking at the thickness of the shielded chips on my 3G (that is currently in pieces on my table) vs what I see on the new PCB, I don't see how it's possible.
So whats stopping them stacking 8x8 for 64gb?Im going to take a guess the current 8gb are roughly the same price as 4gb was last year.
The natural progress of technology. This is the highest density currently reached.
http://www.toshiba.com/taec/news/press_releases/2009/memy_09_585.jsp
And you'd be wrong on the pricing. NAND pricing has gone up.
Edit: Who does the teardowns every year that reveal the individual component pricing?
Who's to say that it couldn't have been 34% thinner, but they decided to make room for two chips?
We'll find out on Monday either way.
Have you looked at that PCB at all?!?!?!?
The ONLY chance is for 64GB NAND chip to be used.
Here is historical pricing for NAND going back to Jan 2009.
http://www.dramexchange.com/WEEKLYRESEARCH/Post/2/2250.html
and another
http://www.dramexchange.com/WeeklyResearch/Post/2/2368.html
I'm not taking sides either way, I just don't think that te argument that the phone is thinner really holds much water.
And as for the circuit board, clearly there has been a MAJOR redesign from the previos generation, as this is tiny in comparison to it (or we're not being shown everything inside the shell). I couldn't tell you what any of the individual components are on that board, and I don't know which previosly seperate components Apple have combined to reduce the size so dramatically. There's far too little information available to make any kind of judgement.
I'm not familiar at all with memory and such. I just thought you could stack 2 32GB chips on top of one another.
Dont' see how it doesn't. Thinner means less volume for components. It's pretty simple. If you've ever opened an iPhone you'd know how cramped they already are.
The way they got the existing chips on the new phone is by "folding" it over. Theyv'e placed the chips on both sides of the PCB instead of just one.
Found it, it was iSuppli. 16GB MLC NAND was $24 last year. Seems to be $25 this year in the iPad. So yeah...NAND prices don't seem to have dropped.
They could be using a 32GB chip on either side of the board to save space. That would give the new phone up to a 64GB capacity without using 64GB chips. And when prices come down, they can use one 64GB chip for the same effect. Then they can use two 64GB chips for a 128GB iPhone next year.
It looks like both the Gizmodo phone and Vietnam phone had shields over some components (all in the Gizmodo phones case), so that would be hidden.
It looks like both the Gizmodo phone and Vietnam phone had shields over some components (all in the Gizmodo phones case), so that would be hidden.