I decided to look into this further.
The problem is the most common defects aren't necessarily associated with trialling new technologies in generation one products.
The iPhone 6 Plus Touch IC problem came about because of an issue with board flex, BGA bonding and chip underfill. There was nothing special about the packaging or placement of this chip from any other IC in recent years, in any device, including chips that Apple ships and has relied on for years, like the SMC, MUX Chips and even CPU and GPU Packages. We've known for years that BGA chips in high-stress areas, be it thermal or physical stress, should use some form of underfill to brace the electrical connections between the chip and the board. Apple learned this first hand with the GeForce 8600M GT issues in the MacBook Pro. We've known for years that placing chips and electrical connections on a thin circuit board, mounted to a thin and flat plane of aluminium and subject to flexing, will over time cause those connections to crack as the metals work harden and become brittle. And yet, all of these factors were overlooked, and this Touch IC problem came to be.
There are multiple other examples as well. The iMac stand mechanism issues came about because plastic composite washers were used to secure load bearing springs under tension, while the mechanism itself was made of rigid steel. The AMD Radeon Graphics issue in the 2011 model iMac (27" Gen. 3) and MacBook Pro (15" Gen. 5) came about because of issues with heat dissipation. The MacBook Pro 2012 (13" Gen. 5) Hard Drive Flex Cable issue remains unresolved, and it's a cable, one of the most basic electrical components in any machine.
And yet, some Apple pioneered technologies seem to work flawlessly. The Retina Display initially experienced some issues with LG panels, but these are relatively minor and later resolved. Apple developed ARM CPUs for both Mac and iOS have been mostly reliable. Force Touch has been flawless on the Mac.
Where these issues seem to develop aren't in new technologies that Apple develops, but in technologies that are already several years old and have already been proven time and time again. As a matter of fact, most issues seem to be attributable to one of three causes - Packaging and Component Placement, Space Constraints and Cost Reductions in Manufacturing. Sometimes it's a combination of the three, and the iPhone 6 Plus is potentially one such perfect storm. The placement of the chip on the board made it susceptible to flex and physical stresses, the thin profile of the phone made it impractical to have any kind of reinforcement behind the board to prevent board flexing, and the omission of underfill from the chip made it more susceptible to those stresses than other equivalent chips.
And none of those three causes are exclusive to generation one products, or even new technologies. They're limitations of our resources and manufacturing processes that manufacturers - including Apple - have known for years, or even decades. We've known how to solder a chip to a board, and prevent it from cracking, for a long time.
Apple and IBM researched this extensively for the PowerPC 970 in the Power Mac G5 - a much larger, much hotter, much more complex chip on a much larger board - in 2004. Somehow that research and the lessons learned from it fell to the wayside for a touchscreen controller in the iPhone 6 Plus.
These issues happen. No company is infallible. But pioneering new, innovative technologies isn't the reason these issues occur in generation one Apple products. Besides, Apple has been manufacturing computers for 41 years now, they're no stranger to the reliability perils that come with a generation one product.
But hey, those are just my findings. What can I say - In the field of electronics, I like researching this stuff.