Become a MacRumors Supporter for $50/year with no ads, ability to filter front page stories, and private forums.
I can't help but wonder, if they had just made it an extra 2mm thicker, if they could've tacked on another hour or two of battery life or stuffed in a better camera.
I would like to see an increased battery option, thicker and pricier. I have posted that since iPhone 1 and it has not happened so I am not holding my breath, but I would rather have double battery than double flash.

I think that since good lenses and photos require device depth, they should put the high resolution still camera facing out the top edge of the device so proper optical zoom and focus can happen. Apple has the technology to really do that right for the first time.

It is hard to underestimate the value of a proper photograph that is in focus and framed for the distance you are from the subject.

Rocketman
 
Then it would have a Cirrus Logic Stamp.

Not necessarily, they stopped putting the brand on their chips in apple products few years ago, I don't know why. Now they are all Apple branded.
Even ifixit guesses : "Apple-branded 338S0940 A0BZ1101 SGP. This looks like the Cirrus audio codec Chipworks found in the Verizon iPhone, but they'll have to get it off the board to make sure."
 
I don't really care for Apples choice of using alot of glue to cut costs. It makes opening and repairing the device on your own that much harder. On the otherhand ipads and iphones are disposal items since the batteries can't be replaced anyway so it's not that big of a deal that they're cheaply made.
 
Elmer's Gluepad


Seriously, why do I feel like the quality of things has gone down the CRAPPER? And not only that, but the products are designed to fail and be replaced/disposed of :(
 
My wife looked at the picture and asked, "Does it still work after they let the Pixie out of it?"

I guess for some people it truly is a ~magical~ device.
 
Wirelessly posted (Mozilla/5.0 (iPhone; U; CPU iPhone OS 4_3 like Mac OS X; sv-se) AppleWebKit/533.17.9 (KHTML, like Gecko) Version/5.0.2 Mobile/8F190 Safari/6533.18.5)

Full of Win said:
Given glue has a tendency to become weaker at higher temperatures, I wonder how long these will hold up to years of high temperatures?

Several years ago, Apple had a patent where they essentially proposed filling these types of devices with epoxy, thereby leaving no internal voids and removing the needs for screws. Guess we are seeing some of it here.

-----

Here it is, sounds familiar.

Full article: http://news.cnet.com/8301-17938_105-9720467-1.html

In plain (or at least plainer) English, that means that Apple thinks it can make lighter, stronger laptop shells by bonding parts together, rather than using screws or rivets. The filing explains, "In recent years portable computers have become thin, light and powerful." This, naturally, leads to "two conflicting design goals--the desirability of making the enclosure lighter and thinner, and the desirability of making the enclosure stronger and more rigid." Using a structural glue or conductive paste would, in theory, allow lighter shells that wouldn't be as susceptible to flexing, bowing, or cracking
.

Oh you thought the iPad 2 was designed by Dell! No, this is Apple they have put thought behind the design the glue will hold up just fine.
 
Glue and breaking clips? It is a throwaway product obviously. It evidently works very nicely, and it is cheap to manufacture, but glue and breaking clips are evil.
 
The Use of Structural Gluing Just Turns Me Off

The extensive use of structural gluing of the major parts in the iPad 2 makes it a $730 (3G w/32gb) through-away product by design. If you look at the iFixit teardowns for the original iPad there is a very apparent drop in overall quality with iPad 2. Then look at the Xoom teardown and you will see why it costs more.

IMO, The iPad 2 will have no resale value in 12-24 months which makes it a poor tablet choice today.
 
the code written on the A5 identifies the ram
K3PE4E400B - XGC1

K3: Samsung Mobile DRAM Stac
P: MDDR2-P(※S4)+MDDR2-P(※S4)
E4: A-Port I/F & Density & Vcc& Org (4 Gbit 2Ch 1.2V 46nm)
E4: B-Port I/F & Density & Vcc& Org
0: Reserved
0: Interposer I/F (0: none)
B: Generation B-Die
X: Package FBGA
G: Temp. (G : -25 ~ 85℃)
C1: Speed (C1 : 2.5ns@RL6, TRCD18ns, TRP18ns ) 800 Mbps

confirmed 512MB DDR2 RAM @800Mbps

references:
http://www.samsung.com/global/business/semiconductor/Greenmemory/Products/LPDDR2/LPDDR2_Lineup.html
http://www.samsung.com/global/business/semiconductor/products/dram/downloads/MobileDRAM_stack_code.pdf


Having all this components inside one chip definitely increases performance.
The comm chip also has a FM Tuner. Could we expect it will someday be taken advantage of? Hopefully Apple will allow developers to create FM Tuner Apps.

Also, I found an easier way to open it: Bring it to Florida during the Summer, leave inside your car for a couple hours (before the battery explodes) and it should easy pry open. :D

I don't consider 512MB to be too little for an iPad. Compared to Windows apps, iOS Apps are well optimized and don't require too much memory to run.
And having the storage on a chip, also makes it fast enough that it could implemented as virtual memory. So we should be in good shape.
 
The extensive use of structural gluing of the major parts in the iPad 2 makes it a $730 (3G w/32gb) through-away product by design. If you look at the iFixit teardowns for the original iPad there is a very apparent drop in overall quality with iPad 2. Then look at the Xoom teardown and you will see why it costs more.

IMO, The iPad 2 will have no resale value in 12-24 months which makes it a poor tablet choice today.

What else would you expect to use? I could only think of using magnets (as used on the iMac) but then a sudden fall could separate the display from the assembly. If you want something to take apart yourself, consider any of the other bulky tablets out there.
 
There should be ram+cpu+gpu stacked

The Apple A5 is (probably) three chips in the same package.
The CPU and the GPU is on the same silicon die, a system-on-a-chip (SoC). The RAM are probably two separate dies stacked on top of the SoC. Together this constitutes three chips in a Package on Package configuration, or PoP.

Doing a microscope survey of the SoC die will determine if the core is what we expect, that the CPU is Cortex-A9 MPcore based, and the GPU is a PowerVR SGX543MP2.
 
Register on MacRumors! This sidebar will go away, and you'll see fewer ads.