Damn, can we at least enjoy the iPhone 14 for a few days before starting to talk about the iPhone 15
Making comparisons is possible of course , we can extrapolate density , we can estimate the leakage or the active power consumption , we cannot know the yield , but from leaks it looks like TSMC are doing well while intel are struggling.The process nodes these days have just become a marketing gimmick which different companies use differently.
comparing intel and TSMC process nodes are like comparing apple to oranges.
In case someone though we would be jumping to 2nm anytime soon:
TSMC's N3 family of process technologies will consist of five nodes in total, all of which will support FinFlex. The lineup includes the original N3, set to enter high-volume manufacturing (HVM) later this year, with the first chips set to be delivered in 2023; N3E with performance-per-watt and process window improvements; N3P with additional performance enhancements; N3S with increased transistor density, and N3X with support for increased voltages, enhanced power deliver; and augmented clock rate potential for ultra-high-performance applications.
TSMC Outlines 3nm Roadmap: Five FinFlex Nodes
TSMC's N3 node looks to have a big and bright future with FinFlex.www.tomshardware.com
An M3 for iPad Pro makes sense - the M2 does not.
From what I read on this same website, going below 2nm will be impossible because of the physics properties of the elements.It's all marketing but yes, the roadmaps go below 1nm in 2030.
Is 1nm even possible?
Yes. These nm are marketing names and nothing more. Not even close to 3nm in reality.Is 1nm even possible?
By the time we get there, most computing is cloud-based and local machines are just screens with an overpowered chip insideIs 1nm even possible?
M3 will hopefully bring first-gen hardware ray-tracing...?
To the benefit of who, exactly?
...N3X with support for increased voltages, enhanced power deliver; and augmented clock rate potential for ultra-high-performance applications.
Yes RT is a handy tool to show you how you can fake it.To anyone doing 3D work and needing/wanting hardware ray-tracing capabilities...?
Well, that sounds like the process the Mac Pro needs to be on...?
May the 2nm be next year as well
Apple's future M3 chip for Macs and A17 chip for iPhone 15 Pro models will be manufactured based on TSMC's enhanced 3nm process known as N3E next year, according to a new report from Nikkei Asia. The devices are expected to launch throughout 2023.
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N3E will offer improved performance and power efficiency compared to TSMC's first-generation 3nm process known as N3, according to the report.
In the meantime, the report claims that Apple plans to use TSMC's first-generation 3nm process for some of its upcoming iPad chips. It's unclear which iPad models the report is referring to, as rumors suggest that Apple will update the iPad Pro next month with the M2 chip, which is manufactured based on TSMC's second-generation 5nm process. A new entry-level iPad with an older A14 chip is also expected later this year.
The report claims that 2023 could mark the second year in a row in which only the Pro models of the new iPhone lineup feature Apple's latest chip. Last week, Apple unveiled iPhone 14 Pro models with an A16 chip based on TSMC's 4nm process, while the standard iPhone 14 and iPhone 14 Plus models are equipped with the previous-generation A15 chip.
Article Link: M3 Chip for Macs and A17 Chip for iPhone 15 Pro Will Reportedly Use TSMC's Second-Generation 3nm Process
Ufff, another person who fell for the “nm” gimmick. Pro tip: “nm” does not actually denote size.
Pretty soon some manufacturer will just say “-17000nm” and these people will go ape-sh*t for it! 🤣
Agree with you that TSMC has more advanced nodes than intel. What I implied by my post was a reply to one of the comment which said that TSMC 3nm is 1/3rd the size of intel 10 nm.Making comparisons is possible of course , we can extrapolate density , we can estimate the leakage or the active power consumption , we cannot know the yield , but from leaks it looks like TSMC are doing well while intel are struggling.
You cannot compare the marketing names , that's true , but we most definitely can deduce that TSMC has the superior node at the cutting edge at the moment , that one is easy to see.
Just FYI , Intel also agrees , which is why they moved some of their high end products to TSMC fabrication![]()
In marketing everything is possible. For those in the real physical world both 5 and 3 nm has nothing to do with the real unit of length called nm anymore. Apart from all being very tiny.Is 1nm even possible?
Yes I know, but power consumption and thermal headroom is more sensitive in iPad than in many Macs including the MacBook Air. Will an M2 down clocked to M1 performance levels be significantly less power consuming compared to an M1? If not, there is no point. Is 5-10% power saving enough to make a new board to fit the larger M2?The A14X had one GPU core binned off its entire run. A14Z turned it on to eek out more time.
M2 with the "additional" GPU cores binned off , cap the turbo , and skip the 24GB RAM configuration is going to cause more problems than the M1 did?
It would have a better fab process node N5P ( vs N5 of M1) and LPDDR5 versus LPDDR4 (again if don't crank clocks to excess also a power savings ). Better economies of scale because using more common parts across products ( as M2 MBA and MBP 13" ramp and deploy. And other LPDDR5 usage across their line up. ).
The iPad Air has an M1. There is less of gap for the iPad Pro is squat for 9 months on the M1.
CNBC did a nice overview of ASML a few months back for someone that used to be unaware of the process further back in the manufacturing process. Interesting stuff.All thanks to ASML. ASML, the Dutch company that makes the most complex machines in the world putting the 3nm structures on the chip. TSMC is using these machines.