Phinius said:
How do you know that Apple didn't have to use liquid cooling? It's only been about 9 months since the 2GHz 970 PowerMac first came out with a brand new cooling system that has 9 fans.
So? They designed and shipped a system which matched their design criteria (their solution was to divide the system into independent zones with independent adjustable rate fans, etc.) and around that same time frame (if not before) they likely already had a liquid cooling system starting to be worked on, to build on this thermal management. They saw the road ahead. In fact the cooling framework setup in the Power Mac G5 chassis and now this liquid cooling is well positioned for the future.
As you state, others don't use liquid cooling... yet they arguably use CPUs with near equivalent and often not greater power dissipation densities then the 970FX (or 970) and with greater over all dissipation per CPU. So if they don't have to use it then Apple didn't have to use either but because of Apple's stronger desire for quiet systems Apple is taking extra steps (just go look at the various silencing products that exists in the market for PC rigs).
Phinius said:
What makes you so sure that Apple would have to use the existing 970 heat sinks for air cooling the 970FX? Seems to me that if Apple can come up with a water cooling system then they certainly would have the ability to design more types of heatsinks.
This presumes a more efficient heat sink could be designed and fitted then what is already in the PowerMac G5s while still maintaining one of the design goals of a quiet system. It also presumes that such a system, if possible, would be cheaper then using a liquid cooling system (thermoelectric cooling device comes to mind but it still requires more efficient heat sinks to make that work since thermoelectric cooling devices contribute heat themselves as the work). Anyway I fully believe that Apple could have used air cooling for the 2.5GHz, even if they are "overclocked" as you imply, but it likely would have required additional air flow and hence noise (IMHO not much in the case of the 2.5GHz 970FX). Also note that man in the PC overclocking crowd do so without having to use liquid cooling, they often can do it by adding more directed air flow.
Phinius said:
It will be at least six months from the time that Apple probably knew about 970FX production problems until the water cooled 2.5GHz PowerMacs are available.
6 months is a rather short time line for the design, testing and tooling of a system like this. I personally doubt this was a reactionary solution as you imply.
Phinius said:
Name one major PC manufacturer that is using water cooling with either the AMD Opteron or Prescott Pentium 4. I did notice that Sony has a desktop model that uses water cooling, but that seems to be a rare exception.
Name one that is using the divided zone cooling to the extent seen in the PowerMac G5 chassis (yeah rack mount stuff). Also name one that is as consistently concerned about making quiet systems as Apple currently is.
Phinius said:
The 66mm2 970FX is 41% smaller than the 112mm2 Pentium 4 Prescott chip. Since a 3.4GHz Prescott process uses up to a peak of 127 watts, then that means a 2.5GHz 970FX would have to use a maximum of 75 watts to have the same power dissipation per mm2 as the Prescott. 90 watts is about the maximum power use of the 130-nm 2GHz 970 chip. Which means that a 3GHz 970FX would have about the same maximum power use as the 130-nm 2GHz 970 chip. Judging from the average power use figures that IBM has released for the 970 and 970FX, it would seem that the average power use has gone down considerably for the 970FX compared to the 970.
Well lets look at things this way using numbers from IBM... a 970FX running at 2GHz typically uses 24.5W while a 970 running at 2GHz typically uses 56W (likely a little more but I am doing a linear scaling of values from a 1.8GHz part). Now for max power lets double things, so 49W 970FX at 2Ghz and 112W 970 at 2GHz. The 970FX has a die size of about 66mm^2 and the 970 has a die size of about 118mm^2 (note the chip package is the same size so the heat sink attachment has the same surface area). That yields power densities of 0.74 for the 970FX and 0.95 for the 970 at 2GHz (note the power density for the 970 is 28% more then that of the 970FX at the same clock rate). One factor for the radical power difference is the switch to 1 volt for the core logic, which is thanks to the process shrink as well.
So the existing air cooling system is at least capable of dealing with dissipating 112 W overall while maintaining a rapid enough heat flow to deal with a power density of 0.95 (per CPU). First thing to note swapping in a PPC 970FX for a 970 at the same clock speed in no way requires a change in cooling (why you don't see the liquid cooling across the board and I do believe we will see / are seeing the 970FX across the board in the new systems because they will be cheaper however in the short run they may be using 970 for the 1.8 & 2 GHz versions to clear inventory).
Now what does a 2.5GHz 970FX burn? Well I don't know (no numbers from IBM) but we can likely bound it. The low end can be guessed at by linear scaling of the power dissipation as you vary the clock rate (for CMOS it generally scales linearly with clock rate). So the low end estimate is 62W. Now a high end estimate can be done by assuming that the 2.5GHz 970FX requires the use of 1.3V for its core voltage (the higher core voltage may be needed to insure enough current flow to allow switching at 2.5GHz). That would put the power dissipation at about 105W (for CMOS it generally scales to the square of the voltage). One final guess would be to note the delta in dissipation between the 1.4GHz (12.3 typical) and the 2.0GHz 970FX and assume that delta scales linearly with clock rate. That comes out to 85W and that is just above the average of the other two numbers. I personally believe it is in the 80s.
So the low guess puts the power density at 0.93, the mid at 1.29 and 1.6 for the high estimate (in one of your posts you seem to believe 50 W average which can be guessed to imply about 100W max or a density of 1.51... which is more then the P4 Prescot at 3.4GHz but anyways...). So if the power is at the low end then the existing cooling system is sufficient without additional airflow. If it is towards the mid (I believe it is around the mid) or high estimate then the existing cooling system may not be sufficient (who knows exactly what it tops out at) and hence an alternate system would be needed if one wants to avoid requiring additional air flow (which obviously Apple is trying to avoid). In other words a good enough reason exists to utilize liquid cooling for the 2.5GHz CPU to help keep the system quiet by improving its ability to transfer heat to air (the liquid flowed radiator will be far better at it then a passive heat sink) that one doesn't have to invoke a reasons such are overclocking (however recall my prior wiggle room comment).