By the way, just adding a drop in the middle and hoping to compress it out evenly via the heat-sink is wrong. You do need to use a piece or cardboard or something and smooth it out as evenly as possible. This is fairly important! So this:
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almost all techs will agree, is wrong!
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I guess you would know better... Make sure you use your method on your next CPU upgrade!
For the rest, I might be wrong, but I still feel...
The pea size method is easiest and produces the same result as the line method. Both, however, are good and either will produce good results. Just know, spreading it all over is a bad idea, not only because spreading it is time consuming and messy, but simply because it doesn't work as well. I have attached a chart comparing the two ways - spread versus dollop/line. And also a quote directly from Arctic Silver Incorporated.

Here is a chart comparing the effectiveness of spread versus dollop/line:


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