So this rumor is basically saying that the M1 die is a chiplet design, and the new MBPs can be configured with two or four chiplets. I.e. An "M1X" is actually just TWO or FOUR M1s with interconnect.
It absolutely makes sense that a laptop with FOUR M1s in it would need significant cooling.
If true, this thing is going to be a beast.
The "bezel" thing I think he actually means "bevel", as in the beveled edges of the aluminum; the shape of the enclosure.
I'm not quite sure how to reconcile this with the "10 core, 8 performance, two efficiency" rumors, but honestly, this sounds much more like a true Pro machine than the previous rumor. Maybe that's the chiplet design for the M2? i.e. "M1" is one 8-core (4+4) chiplet, M1X is two or four M1 chiplets, "M2" is one 10-core (8+2) chiplet, M2X is two or four M2 chiplets.
This honestly makes a lot of sense given how silicon is done today, and the fact that they'll need to put this in a Mac Pro eventually (8 chiplets??).