NEWS AT 9: In a world’s first breakthrough, Apple defies physics by creating a new form of Titanium that is as thermally conductive as Stainless Steel. Until Apple’s new iTit (TM) was introduced, Titanium had roughly half the thermal conductivity compared to a piece of stainless steel with the same cross sectional area.
Moreover Apple was able to achieve this physics defying feat of dissipating with titanium walls only 70% the thickness of the previous steel frame and amazingly has managed all this while using a chip 10% more power consuming than the previous model. Certain Nobel prize incoming for the material scientists that worked on this truly incredible device.
I’m a bit of a high power flashlight enthusiast and while titanium is a popular body material due to its weight / strength ratio, its hideous thermal performance means that heavy copper inserts are basically a must, offsetting much of the the weight advantage and creating a conductive mass in which to sinc and dissipate thermal energy.
If iPhone had introduced a vapour chamber I could believe that performance is similar to the prior model, but as it is, thinner walls, combined with the phone’s low overall mass and much poorer conductivity it’s clear that throttling will be more difficult to mitigate.