Become a MacRumors Supporter for $50/year with no ads, ability to filter front page stories, and private forums.
The only thing is.

As chips get faster, and Apple are going to be forced to fit faster and faster chips whether they like or not, as Android handsets are getting faster all the time, they are going to have to get rid of heat.

A solid metal backplate is going to be the best way of dissipating heat from inside the device.

You mean the backplate that's in contact with the palm of my hand? That doesn't sound like a good plan....
 
But having very breakable glass on both the front & back is good engineering?!

It is not poor engineering (design) but poor manufacturing execution, bad quality control, well there might be some "engineers" responsible for that but they cannot prevent careless users from buying, as also plastic and metal can be broken.
 
You mean the backplate that's in contact with the palm of my hand? That doesn't sound like a good plan....

Yes exactly.

The hot chips press up against a much larger surface area (the backplate) which means the heat is spread out and it just feels warm to the touch.

There is no other way, you can't seal a hot chip inside a tight case with no means of dissipating the heat away from the chips without it overheating.

In the past, due to speeds this did not matter, and to a certain degree new designs with finer chip track widths it will help, but speeds will no doubt rise faster than technical abilities to make them run very cool will.

Like all modern machines that people want to run faster and faster, PC's, Laptops, iMac's (which are really just oversized laptops) they all all need to get rid of the heat.

With a normal PC would can stick in a giant heatsink and a nice large fan to keep things cool as the speeds ramp up. Just think of the size of heatsinks and fans we had back in the Intel 286 CPU days as opposed to nowadays.

With a phone, there is no way to create any active cooling, so you need to get rid of the heat into the air and out of the body of the device somehow.

You will have to transfer the CPU/GPU heat into the case of the device so it can radiate out into the air surrounding it.
 
Not a hope in hell

The idiot that wasted 7 hours of his time designing this horrible mock-up should be shot...
 
Wirelessly posted (Mozilla/5.0 (iPhone; U; CPU iPhone OS 4_3_2 like Mac OS X; en-us) AppleWebKit/533.17.9 (KHTML, like Gecko) Version/5.0.2 Mobile/8H7 Safari/6533.18.5)

The update of the original post is shameless.
Oh wait, we have a credible tip...this is fake!
Happy April's 22 fools day!
:D
 
There is your bigger phone:)

View attachment 282685

Nice!

I'll be calling in an airstrike with that, thankyouverymuch. :D


Wirelessly posted (Mozilla/5.0 (iPhone; U; CPU iPhone OS 4_3_2 like Mac OS X; en-us) AppleWebKit/533.17.9 (KHTML, like Gecko) Version/5.0.2 Mobile/8H7 Safari/6533.18.5)

The update of the original post is shameless.
Oh wait, we have a credible tip...this is fake!
Happy April's 22 fools day!
:D

Hehe . . . believe nothing until you see an actual release. ;)
 
Yes exactly.

The hot chips press up against a much larger surface area (the backplate) which means the heat is spread out and it just feels warm to the touch.

There is no other way, you can't seal a hot chip inside a tight case with no means of dissipating the heat away from the chips without it overheating.

In the past, due to speeds this did not matter, and to a certain degree new designs with finer chip track widths it will help, but speeds will no doubt rise faster than technical abilities to make them run very cool will.

Like all modern machines that people want to run faster and faster, PC's, Laptops, iMac's (which are really just oversized laptops) they all all need to get rid of the heat.

With a normal PC would can stick in a giant heatsink and a nice large fan to keep things cool as the speeds ramp up. Just think of the size of heatsinks and fans we had back in the Intel 286 CPU days as opposed to nowadays.

With a phone, there is no way to create any active cooling, so you need to get rid of the heat into the air and out of the body of the device somehow.

You will have to transfer the CPU/GPU heat into the case of the device so it can radiate out into the air surrounding it.

Don't you think that as processors also get faster, they will also get cooler too? My old amd processor from the early 2000's at 2ghz gets really hot really fast en lou to my new dual-core 2.33 ghz iMac. And my Dell mini 10v with no fans rarely gets above 76ºC at 1.66 ghz.

I may not be correct though, someone please correct my if I'm wrong!
 
Wirelessly posted (Mozilla/5.0 (iPhone; U; CPU iPhone OS 4_3_2 like Mac OS X; en-us) AppleWebKit/533.17.9 (KHTML, like Gecko) Version/5.0.2 Mobile/8H7 Safari/6533.18.5)

Liquidmetal has very special thermal properties.
 
I like that design, besides the home button and edge to edge screen. Though my only problem is that the iPhone 4 seems to be just about the right size (in thickness a bigger screen would be nice) and if it gets thinner it may be to thin to hold.
 
It is not poor engineering (design) but poor manufacturing execution, bad quality control, well there might be some "engineers" responsible for that but they cannot prevent careless users from buying, as also plastic and metal can be broken.

But depending on the type of metal the metal would more than likely dent kind of like the original iPhone.
 
Wirelessly posted (Mozilla/5.0 (iPhone; U; CPU iPhone OS 4_3_2 like Mac OS X; ru-ru) AppleWebKit/533.17.9 (KHTML, like Gecko) Version/5.0.2 Mobile/8H7 Safari/6533.18.5)

First time posting, hope to do out right. Boy, I'd Q for that one, it sure looks like next breakthrough. But we all feel Apple do not need it know, so I'd vote that we finally got news about the iPhone 5, provided that next one will be 4th but with some "super" postfix.
 
Wirelessly posted (Mozilla/5.0 (iPhone; U; CPU iPhone OS 4_3_2 like Mac OS X; en-us) AppleWebKit/533.17.9 (KHTML, like Gecko) Version/5.0.2 Mobile/8H7 Safari/6533.18.5)

InsanelyApple said:
It is not poor engineering (design) but poor manufacturing execution, bad quality control, well there might be some "engineers" responsible for that but they cannot prevent careless users from buying, as also plastic and metal can be broken.

But depending on the type of metal the metal would more than likely dent kind of like the original iPhone.

I do prefer the metal back.
However the glass used in the iPhone is supposed to be highly resistant, but as any glass its weakness is when a sharp object hits it and applies the required stress to produce the failure.
Yes the metal backing will first show up as a dent.
As many choices in the design phase are made based on the final cost of the product, they will move to whatever gives them more profit. The cost of external failures for :apple: is irrelevant as that cost is absorbed by the manufacturers. The volumes are so bug that these failures are merely a fraction of what is in the field. An as the warranty period is only one year, unless the failure rate is big enough to cause bad press and affects a significant quantity of customers they will always do what makes sense for their financial results.
If the invesent in liquid metal is ready to show tangible results in a steady manufacturing activity. We will see some of it. The current manufacturing methods of the metals might not be the leanest ones out there. Hopefully it will be metal and not cheap plastic, even they market it as polycarbonate "whatever", they (the manufacturers) have proven that they cannot deliver consistent quality: they always crack.
 
With Jobs himself getting thinner each year, it's only natural that mac products follow suit!
 
I really like the design of the iphone 4 and would be dissappointed to see Apple return to any type of a metal enclosure on the back. If they tweak out the guts, that's great; but let's not take a step backwards in terms of the overall look and feel of the device.

Honestly, I'm a lot more excited to see where iOS goes as opposed to any hardware changes.
 
Don't you think that as processors also get faster, they will also get cooler too? My old amd processor from the early 2000's at 2ghz gets really hot really fast en lou to my new dual-core 2.33 ghz iMac. And my Dell mini 10v with no fans rarely gets above 76ºC at 1.66 ghz.

I may not be correct though, someone please correct my if I'm wrong!

Oh yes indeed.

Mind you, there were some horridly hot AMD chips (as there have been Intel ones) at some times in the past, and they have indeed learned a lot since those days.

One thing they have learned is that they can't push CPU speeds anywhere near what they thought they could. Intel famously said we would be a 10Ghz years and years ago, before they realised they could not do this.

So they had to come up with other tricks and multiple cores to try and work around the thermal barrier they were hitting. I mean, we don't really want liquid nitrogen cooling systems on our computers ;)

Yet despite this, cooling systems have got a LOT better over the past decade. Just look even at an official intel fan and heatsink on a Sandybridge CPU as opposed to one on a 286, 386, 486 CPU. They are MASSIVE these days in comparison, with 3rd party coolers being even larger.

That's just the CPU's.

Look at a modern medium (medium for a PC, hi end for a Mac) graphics card. It's MASSIVE when you put it against graphics cards of the past, with superbly designed heat pipes and cooling fans.

So, yes, you are quite correct, clever design will overcome heat to a point. However, unlike iMacs and PC's you can't get clever with heat pipes and fans in a phone. I'm sure clever design can only get so far, and we could see customer expectation for speed hikes overtake the ability to have ice cold chipsets in phones is a tight and snug thin case design.

Heat has got to go somewhere
 
With Jobs himself getting thinner each year, it's only natural that mac products follow suit!

Youre-an-idiot.jpg
 
Come on, MacRumors - if the rumor has been busted, why not take this story off page 1? That fancy picture of a new iPhone is leading people on...
 
Heat has got to go somewhere

Well, that may end up being a limitation on phone design.

I mean not only do you have to worry about the back not heating up so much that it burns some one's hand (or becomes uncomfortable enough that it turns a lot of people off from buying it), cause your proposed heat sink is going to be held too (usually heat sinks in computers are not designed to be somewhere where some one might touch it), but, because it's being held (usually when the phone is being used and therefore more likely to heat up), I'm not sure how well it would work for a heat sink when it's got a hand wrapping around the heat sink so it can't dissipate the heat.

My point being I'm not sure it's practical to use the back as a heat sink like you propose. They might have to go with trying to find things that run cooler or some sort of venting system. Or just doing what you pointed out in computers, realizing that they hit a limitation.
 
Wirelessly posted (Mozilla/5.0 (iPhone; U; CPU iPhone OS 4_3_2 like Mac OS X; en-us) AppleWebKit/533.17.9 (KHTML, like Gecko) Mobile/8H7)

Those are some cool sounding ideas. Not sure about whether it will happen in version 5...
 
Fugly

This is close to the uglies, goofiest thing vie ever seen, its a step back not forward. The mockup is horrible as well. the uneven top and bottom border is hideous, the tear drop design plain bad engineering and the screen size/phone size ratio looks out of whack. and a bigger gesture button? ha ha. who ever started this rumor has no clue how apple makes products, if this thing launched there stock would go from 340 to to 240 that day.
 
I guess this serves as a pretty good reminder that this site is called MacRumors, & not MacNews. ...& reading this stuff is largely a waste of time. Apples going to come out with what they come out with when they're good and ready, and then, I'm either going to buy that thing or not. What's the point in spending hundreds of hours following all this?
 
Register on MacRumors! This sidebar will go away, and you'll see fewer ads.