Apple's engineers are reaching the breaking point of the internal chipset layout = a flawed design currently.
First:
we need the kind of chipset miniaturization/consolidation the like of what Apple did to the 2016 MacBook redesigned motherboard!! That in itself was truly innovative: a complete motherboard for a full laptop on Core M the size of a regular 1600Mhz PC3 RAM chip!
Secondly:
The current layout being in an "L-Shape" uses far too much size internally affecting battery capacity.
Could the Rear Single & Dual Camera's be in-line with contact placement on the mobo on 1 side while the front camera on the other? Hmmm.
- HTC was quite good at internal mobo designs with the HTC M series even to the point of layering/stacking to reduce overal length/width volume although increasing thickness slightly which a larger battery made forgivable in some models (models escape me but Verizon models in the last 14mths)
Third: this is a BIG one.
Apple has been making big strides yet small ... implementation with imbedded-SIM for their iPad lineup. Would be great if carriers - major one's across the globe could participate in this along with having competitive roaming agreements to allow for roaming: N.American, European (UK, Germany, China, Italy, France, USSR - sorry not up on my political geographical knowledge but still Russia if not smaller yet still comradish(!), etc), African continent (Mauritania, Nigeria, Egypt, S.Africa), S.America (Brazil, Peru, Argentina, Panama, Columbia, Costa Rica, Guyana, etc).
This could be costly initially but in future generations of iPhones be VERY cost effective. Also for carriers ... huge costs as no need to produce so many NanoSIM cards - many give these free to customers when switching to iPhone or competitor devices currently when it used to cost $15-25CAN/US. Somehow, carriers are eating a large cost here (at least for corporate accounts).